Flexible Electronics News

STMicroelectronics Reveals New Technology Platform for RF Front End of Wireless Devices

Optimized RF Silicon-On-Insulator (SOI) process greatly reduces size of multi-band radios for 4G, other high-speed wireless connections

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By: DAVID SAVASTANO

Editor, Ink World Magazine

Booming demand for faster wireless broadband connections is calling for increasingly complex circuitry inside devices such as smartphones and tablets. STMicroelectronics is addressing that demand by perfecting an advanced component process technology specifically optimized to increase performance and reduce the size of the RF (radio frequency) front-end of mobile devices. In wireless devices, the RF front-end circuit is typically built using individual amplifiers, switches and tuners. As new ...

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